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E4809-045-091-E

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    In-Stock, Ships 1-2 Days

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The E4809-045-091-E was manufactured by Okuma as part of their E4809 PC Board Series. The E4809-045-091-E is a OPUS 5000 II MAIN BOARD that features multiprocessor CNC techonolgy that allowing for effective NC system fucntionality. With a variety of function options, the E4809-045-091-E makes a great option to meet your automation needs.

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Product Description

The E4809-045-091-E PC Board manufactured by Okuma functions as a mainboard. This board is deployed in OPUS 5000II CNC systems. The product is a rigid slotted board that houses the other boards featuring the basic circuitry of the system. The accessory renders the electrical connections through which the other components of the system communicate with one another. The unit weighs 1.84kg. It portrays traces that connect the various components of this board. These traces are imprinted from copper sheets that are laminated on a non-conductive substrate. The PC board is designed using one or more layers that help in the interconnection of components.

A single-layer PCB features just one conducting material layer and one solder mask layer. This is the simplest circuit board and the components of the board are marked using a silkscreen. A double-layer printed circuit board has a conducting layer on the top as well as the bottom. The use of two layers makes the product smaller in size than the single-layer board and more flexible. A multi-layer board features over two conductive layers and is best suited for very complex applications. This E4809-045-091-E board has a one-year backup support period and is delivered globally.

The PCB is mounted using surface mount technology. There are three main steps involved in preparing the board for surface mount. The first step involves applying the solder paste in the right places while the second step entails placing its components on its surface. The third step is called reflow soldering and comprises heating the board until the temperature of the solder paste is just right for forming the solder joints. After each step, an inspection is done to check whether the process is done correctly. This inspection is first done prior to the attachments of the components on the board. It is also carried out before and after the reflow soldering step.

  • E4809045091E
  • E-4809045091E-
  • E 4809 045 091 E
  • E489-045-091-E

E4809-045-091-E Technical Specifications

Board Type : OPUS 5000 II MAIN BOARD
Product Type : PC Board
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