3BP201.4

Product Description

The 3BP201.4 delivers flexible, high-density I/O connectivity in a compact DIN rail-mounted form factor. This backplane provides 4 slots for installing 2005 series I/O modules to bridge signals from equipment into data monitoring and control systems. Housed in a rugged gray enclosure matching 2005 modules, the 3BP201.4 features an integrated communication bus allowing networked addressing of installed devices. This enables organizing I/O points and tagging parameters without extensive wiring.

Configuration is straightforward with dedicated interfaces formalize I/O modules like analog/temperature, digital, serial and more. Once snapped into the 4 slots, the spring-loaded connections make module installation and replacement fast and simple. Integrated bus connectivity makes the 3BP201.4 backplane ideal for distributing I/O throughout large cabinets rather than running long wiring back to the PLC. Modules mount flexibly on 35mm DIN rail while occupying very little space.

Diagnostics are enhanced through the standardized green internal PCB and informative LED indicators. This provides intuitive visual status feedback for each I/O channel to pinpoint wiring faults and simplify troubleshooting. Rugged industrial construction ensures long-term reliability for factory environments. Screw-in connectors, locking tabs, and conformal coating guard against vibration, contaminants, and moisture for uninterrupted performance. The versatile 3BP201.4 allows organizations to bridge legacy systems with the latest data control and analytics software. It brings sensor/device connectivity into the modern era in a plug-and-play architecture.