Product Description

The robust, industrial-grade 3BP151.4 backplane offers 12 slots to securely host up to 10 I/O and system modules in space-constrained cabinets. It measures a compact 165 x 480 x 23 mm yet delivers versatile architecture potential. The backplane features dedicated sections for both main and expansion modules. Ten total spots accommodate system or I/O devices as needed for the application, while 12 physical slots provide installation flexibility. Both device types can populate the backplane in customized combinations. Certified for Canadian and United States installations, this C-UL-US listed product withstands operating temperatures from -20 to +70 degrees C. It holds up to battering vibration, shock, and contamination typical of harsh industrial settings.

With a 12-slot capacity, the 3BP151.4 enables small to mid-sized control designs. Its slim 23 mm profile squeezes into tight cabinet depth, while the 165 x 480 mm footprint fits standard cutouts. Allow 20 mm clearance on both sides during mounting for ventilation and component access. During operation, installed modules communicate over the backplane's System 2005 bus. This provides a reliable, real-time data link between devices from a range of manufacturers. Configuration software tailors the architecture - from distributed I/O to motion control.

This rugged component forms the backbone of vended automation cells, packaging machines, material handling stations, and other intelligent systems. It securely bridges I/O signals to the logic and motion control layers. The compact 12-slot dimensioning integrates meaningful capabilities without oversizing. Tight quality control ensures every backplane delivers consistent performance at extreme temperatures. Only subcomponents passing rigorous testing get integrated into the final product. Every shipped unit then exceeds 1,000 hours of automated thermal and functional testing.