Product Description

The 3BP150.4 is a high-density automation chassis made to fit a wide variety of industrial system and I/O modules. Within its compact 165 x 600 x 23mm dimensions, it houses 15 slots able to accept 13 compatible modules for bridging legacy signals into modern networks. This chassis carries full C-UL-US safety certifications for hassle-free installation across the United States and Canada. It withstands operating temperatures ranging from -20 degrees to +70 degrees C for placement in extreme environments like non-climate-controlled factories or outdoor enclosures.

While very customizable, the 3BP150.4 ships with a 13 slot main backplane perfect for control or communication modules. An additional 13 slot expansion backplane handles pure I/O modules. This segregation helps prevent signal noise without needing shielded cables. The chassis allows hot-swapping of modules without disconnecting field wiring. Quick-release spring terminals enable wiring changes. And 20mm side clearance leaves ample room for all module cabling along with cooling airflow to prevent overheating.

Rugged DIN rail or panel mounts secure the enclosure. It also includes a battery compartment for an optional backup power source to maintain volatile RAM during power outages. This prevents data loss and allows rapid restoration of control activity. Bridging modern device networks with legacy hardwired signals often proves challenging. The versatile 3BP150.4 chassis simplifies merging these disparate interfaces into unified monitoring and control systems. It brings together what were once incompatible worlds.