Product Description

The APCBB1/9 backplane forms the foundation for scalable industrial computing solutions utilizing various Intel embedded processors. As part of the robust APC series, it facilitates installation of modern CPU modules while enabling fast DDR3 memory and generous onboard storage capabilities. Built for withstanding extended temperature extremes, the backplane supports reliable operation in demanding industrial environments.

Optimized for compact footprint designs, the backplane accommodates Intel's embedded CPU offerings across multiple product families. This allows a flexible upgrade path utilizing the latest silicon as requirements evolve over a machine's lifespan. It provides two SO-DIMM slots to populate up to 8GB of memory utilizing today's fastest available DDR3 speeds. Two SATA ports further expand storage options for mass program and data storage.

Powering the system requires a straightforward 12V DC input that avoids complex multi-voltage designs. Efficient heat dissipation occurs passively through the rigid metallic backplane itself and surrounding carrier enclosure materials. Together with an extended operating range from -40 degrees C to 85 degrees C, this allows continuous use in factory environments where climate control can be problematic. Durability is ensured through robust manufacturing suited for vibration and contamination exposure. Compatibility with various operating systems facilitates customization to the targeted process or machine application. This may involve real-time industrial OSes for deterministic closed-loop control or desktop variants where a more accessible interface and software ecosystem proves preferential. Regardless of need, the backplane provides a stable hardware platform capable of evolving over time.